Develop inspection, metrology, chemistry process-control and software capabilities for increasingly complex leading-edge logic and memory manufacturing, including EUV, 2-nanometer nodes, advanced DRAM and high-bandwidth memory.

Expected impact: Maintain KLA's position on critical semiconductor-manufacturing steps and capture incremental process-control demand created by more complex devices, materials and process flows.

Expand process-control solutions for wafer-level packaging, panel-level packaging, integrated-circuit substrates and packaged devices as AI and high-performance computing increase package complexity and value.

Expected impact: Broaden KLA's served market beyond front-end wafer fabrication and increase participation in AI-related advanced-packaging investment.

Grow maintenance, support, spare-parts and productivity services across KLA's installed base to maximize customer uptime, productivity and equipment life.

Expected impact: Increase the scale and durability of recurring, subscription-like service activity as the installed base and tool utilization expand.

Upgrade the enterprise resource planning system supporting daily operations, transaction processing, management information and financial reporting.

Expected impact: Modernize critical operating and reporting infrastructure; successful implementation should improve the platform supporting global business processes.